Which product are you looking for?

The high heat losses from press-pack, IGBT or SiC power devices can easily be conveyed outward via heat pipe cooling units. A heat pipe is a device that uses “phase change fluid” to efficiently conduct large amounts of heat between two solid surfaces.

Designed for for High Power Density Applications such as SiC Applications

Liquid cooling
Low to medium performance requirements at cost effective solutions.

Liquid cooling
A complete range of battery cooling solutions to address every application.

When our all aluminum high performance heat sinks cannot meet the operational performance required and liquid cooling is not an option, it is time to try our mixed metal solution.

Liquid cooling
Extremely robust and flux free heat sink with excellent thermal performance.